发明名称 PATTERN FORMING METHOD AND APPARATUS
摘要 A pattern forming method includes forming a resist film or sequentially forming a resist film and a protection film in this order on a surface of a substrate; then, performing immersion light exposure that includes immersing the resist film or the resist film and the protection film formed on the substrate in a liquid during light exposure, thereby forming a predetermined light exposure pattern on the resist film; and performing a development process of the light exposure pattern by use of a development liquid, thereby forming a predetermined resist pattern. After the immersion light exposure and before the development process, the method further includes performing a hydrophilic process of turning a surface of the resist film or the protection film serving as a substrate surface into a hydrophilic state to allow the substrate surface to be wetted with the development liquid overall.
申请公布号 US2008038671(A1) 申请公布日期 2008.02.14
申请号 US20070782233 申请日期 2007.07.24
申请人 TOKYO ELECTRON LIMITED 发明人 YAMAMOTO TARO;KOSUGI HITOSHI;YAMADA YOSHIAKI;SAIGA YASUHITO
分类号 G03B27/42;G03C5/00 主分类号 G03B27/42
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