发明名称 A CAMERA MODULE PACKAGE
摘要 A camera module package is provided to form a vent in an outer surface of a housing to remove inner air pressure generated when hardening an adhesive between the housing and a substrate, thereby facilitating an assembling process without looseness of component parts. A lens barrel(110) has at least one lens. A housing(120) is joined to the lens barrel such that the lens barrel is movable in an optical axis direction. An image sensor(130) has an image formation region on which light is imaged wherein the light is incident through the lens. The image sensor is flip-chip-bonded to a substrate(140). The image sensor has one end fixed to a lower end of the housing through the substrate. A ventilation part has at least one vent(155) formed in an outer surface of the housing. An inner environment of the housing is connected to an outer environment of the housing through the vent.
申请公布号 KR20080014448(A) 申请公布日期 2008.02.14
申请号 KR20060076197 申请日期 2006.08.11
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JUNG JIN
分类号 H04N5/225 主分类号 H04N5/225
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