| 摘要 |
A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120 DEG C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a matrix forming flowable plastic resin such as microwax, silicone wax, or other silicone polymer to form the thermally conductive mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metal alloy coated particulate, balance flowable plastic resin. <IMAGE> |
