IMAGE SENSOR MODULE

摘要

An image sensor module is provided to prevent a sensor from being contaminated by assembling an image sensor chip at a wafer level without cutting the image sensor chip. A PCB substrate(1) and an image sensor wafer(2) are attached to each other. The image sensor wafer and a waffle wafer(12) for an infrared blocking filter holder are attached to each other. The waffle wafer for an infrared blocking filter holder and an infrared blocking filter are encapsulated. A waffle wafer(13) for a lens holder and the PCB substrate are attached to each other. The waffle wafer for a lens holder and a lens(9) are attached to each other. A waffle wafer(14) for a protection glass and a protection glass are encapsulated. An image sensor module is cut.