PHOTOSENSITIVE RESIN COMPOSITION, AND, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PARTITION WALL FOR PLASMA DISPLAY PANEL USING THE COMPOSITION

摘要

A photosensitive resin composition which comprises (A) a binder polymer, (B) a photo-polymerizable compound having a polymerizable ethylenic unsaturated bond, (C) a photo-radical polymerization initiator comprising a 2,4,5-triaryl imidazole dimer or a derivative thereof and (D) a compound represented by the following general formula (1): (1) wherein R1 and R2 each independently represent an alkyl group having 1 to 20 carbon atoms or the like, and R3, R4, R5, R6, R7, R8, R9 and R10 each independently represent a hydrogen atom or the like.