| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for reducing the stress of a solder bump and for preventing a crack from being caused at connections, an electronic circuit device, and its manufacturing method. SOLUTION: The semiconductor device is provided with a semiconductor substrate 3, a semiconductor component that is formed at the first surface side of one surface of the semiconductor substrate, an insulation substrate 2 for mounting the semiconductor substrate 3, a wiring pattern 6 that is formed between the layers of the semiconductor substrate 3 and the insulation substrate 2 and allows the semiconductor component to conduct electricity, a through hole 11 that is formed on the insulation substrate 2 and reaches the wiring pattern 6, an insulation layer 12 for covering the side surface in the through hole 11, a through hole burial part 13 that is formed in the through hole 11 via the insulation layer 12, is connected to the wiring pattern 6, and is made of a conductor, and a solder bump 17 that is connected to the through hole burial part 13 and becomes an external terminal. An electronic circuit device and its manufacturing method are also disclosed in the same manner as the semiconductor device. |
