发明名称 |
GROUP III-V NITRIDE COMPOUND SEMICONDUCTOR DEVICE AND ELECTRODE-FORMING METHOD |
摘要 |
<p>The present invention generally relates to a III-V nitride semiconductor device, and more particularly, to a III-V nitride semiconductor device, such as a GaN-based semiconductor device, which includes a low contact-resistant electrodes formed on an n-type layer of a semiconductor and a method of forming the above electrodes. To provide the method of forming the low contact-resistant electrodes and the semiconductor device including the electrodes, at least Ti, Al and Si are used as materials for the electrodes formed on the surface of the n-type layer of the III-V nitride semiconductor. More particularly, electrodes having a reliable performance can be obtained by forming a Ti layer on the surface of the n-type layer of the III-V nitride semiconductor and subsequently depositing a layer including a disordered phase of Al and Si on the Ti layer.</p> |
申请公布号 |
EP1887618(A1) |
申请公布日期 |
2008.02.13 |
申请号 |
EP20060746863 |
申请日期 |
2006.05.25 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
IKEDA, NARIAKI;YOSHIDA, SEIKOH |
分类号 |
H01L21/28;H01L21/338;H01L29/778;H01L29/812 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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