| 摘要 |
[PROBLEMS] To provide a method for manufacturing printed wiring boards, by which bumps having different diameters can be formed with the same height. [MEANS FOR SOLVING PROBLEMS] A small diameter bump (78S) is formed from a small diameter solder ball (77M) mounted on a small diameter opening (71S) on a solder resist layer (70), and a large diameter bump (78P) is formed from a large diameter solder ball (77L) mounted on a large diameter opening (71P). Therefore, the small diameter bump (78S) and the large diameter bump (78P) having different diameters can be formed with the same height (H1, H2). Thus, when an IC chip (90) is mounted through the small diameter bump (78S) and the large diameter bump (78P), reliability in connection of the IC chip (90) with a multilayer printed wiring board (10) can be ensured. |
