| 摘要 |
<p>A vertical power LED is provided to rapidly radiate the heat generated from a packaged horizontal power LED chip by bending a leadframe and attaching the bent leadframe to a heat sink. An LED device(11) is placed in a concave groove(10) recessed as a cup shape in a first leadframe(13). The first leadframe is connected to the LED device by a conductive wire(12) to supply power to the LED device from the outside. At least one heat radiation hole(18) is formed in the first leadframe to increase a heat radiation speed. A second leadframe(15) is connected to the LED device by a conductive wire(14) to supply power to the LED device from the outside, confronting the first leadframe. The upper portion of the first and the second leadframes are molded by a transparent molding material(16) including the LED device. The first and the second leadframes exposed to the outside of the molding material are bent in a direction vertical to the irradiation direction of the light from the LED device to freely adjust a directivity angle of the light emitted from the LED device to a front surface.</p> |
