| 摘要 |
<p>A fabricating method for a chip molding type semiconductor package is provided to improve an electric characteristic and reliability of a chip by sawing and molding a wafer in a semiconductor chip size after attaching a wafer to a tape while forming a bump in an I/O terminal of a semiconductor chip with a wafer state. A fabricating method for a chip molding type semiconductor package comprises the following steps of: forming a bump(10) in a bond pad(2) on a wafer(1) which a semiconductor chip is formed on; sawing the wafer with the bump according to a size of the semiconductor chip; molding the wafer with a molding material and forming a protection layer(13) by baking the wafer; and exposing a partial end of the bump by grinding the protection layer. In the sawing step, the wafer is sawed after a tape is attached a side of the wafer which the bump is formed on.</p> |
