| 摘要 |
<p>A semiconductor transfer robot is provided to prevent the damage of a thin film formed on a semiconductor substrate by arranging a pad made of a metal oxide on a blade to prevent static electricity between the pad and the substrate. A robot arm is coupled to a robot body and moves. A blade(200) is coupled to the robot arm. A semiconductor substrate(100) is mounted on the blade. One or plural pads(250) are disposed on the blade and made of a metal oxide. The metal oxide is Al2O3. The blade is comprised of a body and one or plural finger(220). One or plural protrusion units are arranged at an end of a side of the finger to prevent separation of the semiconductor substrate. The protrusion unit is protruded to less than 0.1 mm. The blade includes one or plural semiconductor substrate recognizing sensors to recognize the mounted semiconductor substrate. A groove is formed on the blade and a pad is inserted into the groove. The pad has a coating layer on a surface thereof.</p> |
