| 摘要 |
A method for connecting a semiconductor chip with bamps to a substrate is provided to improve attachment reliability and to reduce connection time by using a specific relationship between a polymeric initiator and a compression temperature. An isotropic conductive adhesive(20) is interposed between a semiconductor chip with bamps and a substrate. The isotropic conductive adhesive contains a radical polymer material, a radical polymeric initiator, and a conductive particle(24) which is transformed by pressure. In case a heating time S(minute) is 1 S 30, a half-life temperature during 1 minute of the radical polymeric initiator is T1(°C), and a pressurizing temperature is T2(°C), relationships of T1 + x = T2 and 15 x 70 are satisfied. The pressurizing temperature is in the range from 140 to 240 °C. The radical polymer material is selected from acrylate, methacrylate, maleimide, and styrene derivative. The radical polymeric initiator is selected from peroxyketal, peroxyester, and dialkyl peroxide.
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