发明名称 |
WATER-SOLUBLE PREFLUX AND USE THEREOF |
摘要 |
It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux. Another object is to provide a printed wiring board wherein the surface of a metal conductive part has been brought into contact with the above water-soluble preflux and a soldering method which comprises bringing the surface of a metal conductive part into contact with the above water-soluble preflux and subsequently soldering the surface. A water-soluble preflux comprising an imidazole compound and a carboxylic acid compound having 4 to 16 carbon atoms represented by the following general formula 1:
wherein R 1 represents a linear or branched alkyl group having 1 to 4 carbon atoms, R 2 represents a hydrogen atom or a methyl group, m represents an integer of 0 to 3, and n represents 1 or 2. |
申请公布号 |
EP1886759(A1) |
申请公布日期 |
2008.02.13 |
申请号 |
EP20060746755 |
申请日期 |
2006.05.23 |
申请人 |
SHIKOKU CHEMICALS CORPORATION |
发明人 |
HIRAO, HIROHIKO;KIKUKAWA, YOSHIMASA;MURAI, TAKAYUKI |
分类号 |
B23K35/363;B23K35/36;B23K35/362;C08G18/10;C08L75/00;C23C22/52;C23F11/14;H01L21/56;H05K3/28;H05K3/34 |
主分类号 |
B23K35/363 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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