发明名称 |
Thermally conductive material |
摘要 |
<p>A low viscosity composition for use in varying applications, such as an encapsulant, anti-corrosive, adhesive and/or thermal interface material in an electronic device is provided. The composition comprises a blend one or more resins, one or more curing agents, one or more reactive diluents and one or more thermally conductive filler having particles with a high aspect ratio.</p> |
申请公布号 |
EP1887033(A1) |
申请公布日期 |
2008.02.13 |
申请号 |
EP20070015509 |
申请日期 |
2007.08.07 |
申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
RUYTERS, MICHEL;BOSMANS, CHRIS |
分类号 |
C08K3/00;C09J11/04;H01L23/29;H01L23/373;H01L23/42 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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