SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

A semiconductor package and a manufacturing method thereof are provided to prevent a solder joint crack by forming a solder ball in a via hole that is created in a substrate. A semiconductor package includes a substrate(150), a semiconductor chip(170), an adhesive layer(160), a bonding wire(180), an encapsulation unit(190), and solder balls(310). Plural via holes(130) are formed in the substrate. The semiconductor chip is stacked on the substrate. The adhesive layer die-attaches the substrate to the semiconductor chips. The bonding wire electrically connects the substrate to the semiconductor chip. The encapsulation unit is formed on the substrate including the bonding wire. The solder balls are filled in the plural via holes. The solder ball is protruded to upward and downward directions with respect to the via hole. A second semiconductor package group is comprised of one or more semiconductor package laminated on the semiconductor package. The solder balls are arranged to be corresponded to each other and contacted to each other between the adjacent semiconductor packages.