发明名称 Method and apparatus for inter-chip wireless communication
摘要 In one embodiment, the disclosure relates to a method and apparatus for inter-chip wireless communication system. The system includes a first microprocessor having a plurality of non-contact ports and a first RF communication circuit integrated with the first microprocessor; a second microprocessor also having a plurality of non-contact ports and a second RF communication circuit integrated therein. An RF communication protocol can be configured to receive data from each of the non-contact ports in parallel, multiplex and translate the data to a serial RF signal. Data communication can be accomplished using the wireless communication circuit on each chip. The RF communication between the first and the second integrated circuits using the communication protocol defines a non capacitive-coupling of the first and the second die.
申请公布号 US7330702(B2) 申请公布日期 2008.02.12
申请号 US20050045050 申请日期 2005.01.31
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHEN KER-MIN;HUNG TSUNG-YANG
分类号 H04B1/40 主分类号 H04B1/40
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