MEMORY MODULE HAVING IMPROVED DISCRETE DEVICES ARCHITECTURE

摘要

A memory module having discrete devices with an improved arrangement structure is provided to mount memory chips with different sizes on printed circuit boards with the same size, by mounting the memory chips on the printed circuit board even if the memory chip has an outer dimension greater than a memory pad region. A plurality of tabs(113) are disposed at the edge of at least one surface of a substrate main body(100). A memory pad region is disposed on the same surface of the tabs and includes memory chip pads electrically connected to the tabs. Discrete devices(97) are limitedly disposed in one direction in the periphery of the memory pad region and is electrically connected to the tabs and the memory chip pads. The discrete devices are disposed between the tabs and the memory pad region. A memory chip(90) is mounted on the memory pad region.