发明名称 Semiconductor memory device including storage nodes and resistors and method of manufacturing the same
摘要 A semiconductor memory device according to embodiments of the invention includes storage nodes and resistors. A method of manufacturing the semiconductor memory device according to some embodiments of the invention includes forming an interlayer insulation layer on a semiconductor substrate including a memory cell array area and a core/perimeter area; forming a first etch stop layer thereon; forming a plurality of contact plugs arranged linearly in at least one direction on the memory cell array area; forming a first conductive layer on the resultant structure; forming a second etch stop layer thereon; etching the second etch stop layer and the first conductive layer and forming landing pads and resistors arranged non-linearly in at least one direction; and forming storage nodes on the entire outer lateral surfaces of which are exposed, on the landing pads.
申请公布号 US7329918(B2) 申请公布日期 2008.02.12
申请号 US20060419710 申请日期 2006.05.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO CHANG-HYUN;CHUNG TAE-YOUNG;AHN YONG-SEOK
分类号 H01L27/108;H01L21/02;H01L21/8234;H01L21/8242;H01L21/8244;H01L27/02;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L27/108
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