| 摘要 |
A semiconductor device including: a semiconductor chip having a rectangular surface on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the surface of the semiconductor chip; and a plurality of interconnects each of which is electrically connected to one of the electrodes and includes an electrical connection section disposed on one of the resin protrusions. At least part of the resin protrusions are disposed in a region near a short side of the surface and extend in a direction which intersects the short side. |
