| 摘要 |
A laser diode package ( 10 ) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package ( 10 ) includes a laser diode bar ( 12 ), a forward-biased diode ( 14 ), a heat sink ( 18 ), and a lid ( 16 ) which may have fusible links ( 86 ). The laser diode bar ( 12 ) and the forward-biased diode ( 14 ) are electrically connected in parallel between the heat sink ( 18 ) and the lid ( 16 ). The emitting region of the laser diode bar ( 12 ) is aligned to emit radiation away from the forward-biased diode ( 14 ). Several packages can be stacked together to form a laser diode array ( 42 ). The forward-biased diode ( 14 ) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar ( 12 ), thus preventing an open-circuit failure from completely disabling the array ( 42 ). The fusible links ( 86 ), if used on the lid ( 16 ), prevent damaged active regions ( 90 ) in a laser diode bar ( 12 ) from short-circuiting and drawing more electrical current than the other active regions ( 90 ).
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