| 摘要 |
A method for testing a semiconductor device is provided to improve test reliability by performing a test process in two steps within a minimum interval of time. A first test process is performed on the entire test item of a number of semiconductor devices selected from a plurality of semiconductor devices formed on a wafer. According to the test result, a second test process is performed on a number of test items selected from the entire test items of the rest of the semiconductor devices. A test item for performing the second test process can include a test item selected according to the result of the first test process and a test item selected regardless of the first test process.
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