| 摘要 |
A compound composition for an air permeable film is provided to improve surface characteristics, processability, heat resistance, tensile strength and moisture permeability. A compound composition for an air permeable film comprises 100 parts by weight of an inorganic filler; 30-70 parts by weight of a linear low density polyethylene resin having a melt index of 0.9-1.5 g/10 min and a density of 0.914-0.925 g/cm^3; 15-25 parts by weight of a linear low density polyethylene resin having a melt index of 5.0-14.0 g/10 min and a density of 0.918-0.925 g/cm^3; 15-25 parts by weight of a low density polyethylene resin having a melt index of 1.5-2.0 g/10 min and a density of 0.928-0.932 g/cm^3; and 0.5-2.0 parts by weight of a compatibilizer.
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