发明名称 |
Structure and method for bonding to copper interconnect structures |
摘要 |
An integrated circuit structure and a method for fabricating the structure. The method comprises forming a copper bond pad for attaching the integrated circuit to a package. Copper oxide is removed from the pad by reduction in a hydrogen ion atmosphere. For attaching the integrated circuit to a bump-bonding package an under-bump metallization layer is formed over the reduced copper pad and a solder bump formed thereover. The process can also be employed in a wire bonding process by forming an aluminum layer overlying the cleaned copper pad. The structure of the present invention comprises a copper pad formed in a substrate. A passivation layer defining an opening therein overlies the copper pad. A under-bump metallization layer is disposed in the opening and a solder bump overlies the metallization layer. Alternatively, the structure further comprises an aluminum pad disposed overlying the reduced copper pad. |
申请公布号 |
US7328830(B2) |
申请公布日期 |
2008.02.12 |
申请号 |
US20030741155 |
申请日期 |
2003.12.19 |
申请人 |
AGERE SYSTEMS INC. |
发明人 |
BACHMAN MARK ADAM;CHESIRE DANIEL PATRICK;MERCHANT SAILESH MANSINH |
分类号 |
B23K31/02;B23K35/14;H01L21/02;H01L21/311;H01L21/3213;H01L21/60;H01L23/485 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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