STRUCTURE AND ASSEMBLY METHOD OF IC PACKAGING,申请号KR20060052723-传众专利搜索

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发明名称	STRUCTURE AND ASSEMBLY METHOD OF IC PACKAGING
摘要
申请公布号	KR100801197(B1)	申请公布日期	2008.02.11
申请号	KR20060052723	申请日期	2006.06.12
申请人		发明人
分类号	H01L21/60;H01L23/48	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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