HEAT SINK FOR LED PACKAGE AND LED PACKAGE USING THE SAME

摘要

A heat-sink for an LED package and the LED package using the same are provided to reduce loss of light by forming a reflection surface on an inner wall of a cavity. A lead frame is installed in a package body. A heat-sink(20) is inserted into the inside of the package body. A cavity is formed at a top end of the heat-sink. A groove is formed along an edge of a bottom of the cavity. A protrusive stage is formed at the inside of the groove. An LED chip(2) is attached to the protrusive stage of the heat-sink. A fluorescent resin body(52) is formed by depositing a liquefied resin including a fluorescent material on an upper surface of the protrusive end. The inner wall of the cavity has an inclined reflection surface which is reduced from an upper part to a lower part thereof.