METHOD OF BONDING AND MANUFACTURING DISPLAY APPARATUS

摘要

A bonding method and a method for manufacturing an LCD are provided to connect a substrate and an electronic device electrically and physically using a print unit, thereby minimizing the amount of unnecessary conductive material and preventing contact defect between the substrate and the electronic device. A conductive solution(400) containing conductive particles(410) and an adhesive material(420) is jetted on a substrate(310) on which a conductive pad(312) is formed, by using a print unit(1) having a nozzle. A connection terminal of an electronic device is positioned correspondingly to the conductive pad of the substrate. The conductive pads and the connection terminal are pressurized at a high temperature, thereby electrically and physically connecting the conductive pad and the connection terminal.