发明名称 CUTTING EQUIPMENT OF PANEL AND METHOD FOR CUTTING OF PANEL USING THE SAME
摘要 An apparatus and a method for cutting a panel are provided to reduce a space required for a penal cut process by performing the cut process in a state that a panel is vertically erected on the ground by using return panels and to improve panel cut efficiency by simultaneously forming cut lines on first and second substrates. A method for cutting a panel comprises the following steps of: cutting and separating a mother panel(6) attached with first and second substrates(2,4), and arranging the separated plural panels on a first cassette(20); mounting plural return pads(30) in a length side of the panel; vertically erecting the panel on the ground by using the return panels; and simultaneously forming cut-prediction lines on the first and second substrates by using a first cut member, disposed on the first substrate of the panel, and a second cut member disposed at the same location as the first cut member on the second substrate.
申请公布号 KR20080011982(A) 申请公布日期 2008.02.11
申请号 KR20060072836 申请日期 2006.08.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JEONG, SEOK HWA
分类号 G02F1/13 主分类号 G02F1/13
代理机构 代理人
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