| 摘要 |
A multi-layer flexible film package and an LCD comprising the same are provided to form a ground layer on the multi-layer flexible film package to improve the return path for current, thereby shielding electromagnetic waves and preventing electrostatic discharge. An insulating film(210) has circuit patterns and internal ground lines(231,232) formed on one surface thereof. An insulating layer(240) is formed on the circuit patterns and the internal ground lines. A driving IC(250) is electrically connected to the circuit patterns and the internal ground lines. A ground layer(270) is formed on the other surface of the insulating film and connected to the internal ground lines. Via-holes(281,282) are formed to pass through the insulating film. The internal ground lines are electrically connected to the ground layer through the via-holes. |
