An LED package is provided to prevent reduction of lifetime by suppressing permeation of moisture and to prevent a wire short between a lead frame and an LED chip. A lead frame is formed by cutting and bending a metal plate, and is composed of a chip attaching part(12) and a plurality of terminal parts(14,16). One or more LED chips(2) are attached on the chip attaching part. The terminal parts are separated from the chip attaching part or are extended from the chip attaching part. A housing is formed to support the lead frame. The terminal parts are penetrated from the inside to the outside of the housing. One or more terminals include a moisture defense part. The moisture defense part is used for preventing permeation of moisture from the outside the inside of the housing.
