发明名称 COMPOSITION FOR IMPROVING THE ADHESIVENESS OF THE PHOTOSENSITIVE ORGANIC INSULATING LAYER
摘要 <p>A composition for forming a photosensitive organic insulating layer, and an organic insulating layer prepared by using the composition are provided to improve the adhesion with a substrate remarkably and to enhance sensitivity. A composition for forming a photosensitive organic insulating layer comprises a photosensitive material; an alkali soluble resin; a solvent; and an acrylic copolymer containing a photosensitive group at terminal represented by the formula 1, wherein R, R1, R2 and R3 are independently H, CH3, an alkyl group or an aryl cyclic group; and a, b, c and d are independently an integer of 0-3. Preferably the composition comprises further a thermal acid generator represented by the formula 2, wherein R is an alkyl group or OH.</p>
申请公布号 KR20080011880(A) 申请公布日期 2008.02.11
申请号 KR20060072577 申请日期 2006.08.01
申请人 DONGWOO FINE-CHEM CO., LTD. 发明人 JIN, SUNG YEOL;MOON, SUNG BAE
分类号 G03F7/004;H01L29/786 主分类号 G03F7/004
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