发明名称 CHIP MOUNTER
摘要 A component mounter is provided to reduce time for mounting components by removing a substrate recognizing camera to reduce weight of a head unit. A component mounter includes a frame, a head body(110), a first reflector(112), a second reflector(116), and a photographing unit. The frame has a conveyor to transfer a circuit board, and a component supply unit to supply components. The head body is coupled to the frame to be movable in X-Y directions, and absorbs the component from the component supply unit to mount the components on the circuit board. The first reflector reflects images of a plurality of nozzles supported on the head body. The second reflector is installed at one side of the first reflector to reflect an image of an identification mark of the circuit board. The photographing unit photographs the images reflected by the first and second reflectors.
申请公布号 KR20080011811(A) 申请公布日期 2008.02.11
申请号 KR20060072255 申请日期 2006.07.31
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 SEO, YOUNG SEOK;SEOK, DONG JU
分类号 H05K13/04 主分类号 H05K13/04
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