INTERGRATED MODULE WHICH HAVE MULTIPLE STRUCTURE AND FABRICATING METHOD THEREOF

摘要

An integrated module having a multiple structure and its fabricating method are provided to achieve thermal stability of a semiconductor chip and shield an electromagnetic wave of a high frequency device without an additional process. An integrated module(300) having a multiple structure includes a printed circuit board(310) and a metal member(340). The printed circuit board has at least one hole(311) and a groove(312). The at least one hole passes through opposite first and second surfaces of the printed circuit board. The groove is formed on the second surface of the printed circuit board. The metal member is received on the second surface of the printed circuit board to be contacted with the second surface of the printed circuit board. The integrated module having the multiple structure further includes a semiconductor chip(333), a high frequency device(331), and a plurality of passive devices(334). The semiconductor chip is inserted into the hole and placed to be contacted with a side of the metal member. The high frequency device is received on the groove and blocked by the metal member. The plurality of passive devices are placed on the first surface of the printed circuit board.