| 摘要 |
<p>A semiconductor package is provided to reduce a warpage phenomenon of a printed circuit board after a molding process by guaranteeing a space of a printed circuit board so that a semiconductor package is constructed. A semiconductor chip(4) having a bonding pad(1) is attached to the surface of a printed circuit board(2) with an electrode terminal(3) by using adhesive(5) as a medium. The bonding pad of the semiconductor chip is electrically connected to the electrode terminal of the printed circuit board by a metal wire(6). The semiconductor chip including the metal wire and the lateral surface of the printed circuit board are molded by encapsulant(7). The printed circuit board has a smaller size than that of the semiconductor chip, including a step surface in which the electrode terminals are arranged. The bottom surface of the printed circuit board is exposed from the encapsulant, and ball lands(8) are arranged on the exposed surface. Solder balls(9) can be attached to the ball lands on the bottom surface of the substrate.</p> |
