发明名称 MANUFACTURING METHOD OF SUBSTRATE, MANUFACTURING METHOD OF TFT SUBSTRATE, MANUFACTURING METHOD OF MULTILAYERED STRUCTURAL SUBSTRATE AND MANUFACTURING METHOD OF DISPLAY DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate capable of enhancing the yield of the substrate by enhancing the impact resistance of the substrate at the time of handling of the substrate and suppressing the occurrence of the chipping of the corner part of the substrate. <P>SOLUTION: The manufacturing method of a substrate P as the substrate is constituted so as to irradiate the substrate P as the substrate with a laser beam 45 to form a divided piece Q1 and includes a process for forming a material deteriorated part 47 by obliquely irradiating the surface Pu of the substrate P with the laser beam 45 and a process for forming the divided piece Q1 by applying stress F to the substrate P. By this method, an inclined surface M is formed to the substrate P. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008018547(A) 申请公布日期 2008.01.31
申请号 JP20060190085 申请日期 2006.07.11
申请人 SEIKO EPSON CORP 发明人 KUROKI YASUNOBU
分类号 B28D5/00;B23K26/06;B23K26/38;B23K26/40 主分类号 B28D5/00
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