| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device that has a simple structure so as to facilitate its assembly and to be stably manufactured, while preventing solder from flowing to the chip end faces regarding the electronic device such as a semiconductor laser, and to provide its mounting method. SOLUTION: The electronic device is composed by mounting a semiconductor laser chip 1 on a stage 5 by soldering. Grooves 4 extended in a direction orthogonal to a laser-beam emitting direction of the semiconductor laser chip 1 are formed on a mounting surface of the semiconductor laser chip 1. A depressed part 8 that allows the stage 5 to be fitted into it is formed in the mounting surface of the semiconductor laser chip, while leaving each stepped part 9 at both end edges in the laser-beam emitting direction at each of spaces between laser-beam emission end faces 2 of the semiconductor laser chip 1. COPYRIGHT: (C)2008,JPO&INPIT
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