发明名称 MICROPLATE
摘要 PROBLEM TO BE SOLVED: To provide a microplate easy to mold constituted so as to eliminate a trouble caused by an excess and a deficiency of the adhesive of the bottom part transparent plate material bonded to a plate main body. SOLUTION: An adhesive housing part 5 for housing an excessive amount of an adhesive is provided in an opening peripheral edge part to which a bottom plate 3 is bonded. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008020230(A) 申请公布日期 2008.01.31
申请号 JP20060190180 申请日期 2006.07.11
申请人 APIC YAMADA CORP 发明人 KIDA KENJI
分类号 G01N21/03 主分类号 G01N21/03
代理机构 代理人
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