| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate polishing device capable of polishing the end surface of a substrate (bevel surface or notch surface) evenly with a high degree of accuracy all the time with a simple structure, and to provide a substrate polishing method and a substrate treating device using the substrate polishing device. SOLUTION: This substrate polishing device is provided with a suction stage 10 sucking and holding the substrate 12, and a spindle 20 mounting a grinding wheel 22. In this device, the grinding wheel 22 rotating while being mounted to the spindle 20 is abutted on the end surface of the substrate 12 rotated or stopped while being sucked and held on the adsorption stage 10, thereby polishing the end surface of the substrate 12. The spindle 20 is mounted in a linear motion guide 23 moving on a straight line in parallel with a straight line connecting the center of the grinding wheel 22 and that of the substrate 12 so as to be moved on the parallel straight line by the linear motion guide 23. COPYRIGHT: (C)2008,JPO&INPIT
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