| 摘要 |
[PROBLEMS] To provide a hot-melt adhesive for fixing IC modules, which has sufficient transparency and excellent solvent resistance, and to provide a laminated tape and an IC card using such adhesive. [MEANS FOR SOLVING PROBLEMS] The hot-melt adhesive for fixing IC modules contains a saturated polyester resin having a melting heat quantity of 8-25mj/mg and a transmissivity of 5% or more when measured with visible light having a wavelength of 600nm by using a film having a thickness of 30µm. The laminated tape (T) is provided with an IC module tape (121), which has a module base material tape (121a), an IC chip (12b) arranged on one surface of the tape, and a sealing section (12c). The laminated tape is also provided with an adhesive tape (131), which is bonded to the one surface of the module base material tape (121a) and the sealing section (12c) and uses the hot-melt adhesive. Furthermore, the IC card is provided with a card main body, an IC module and an adhesive layer bonding the card main body and the IC module. |
