| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for securely fabricating a conductive structure on a matter for print and a printed circuit board material. SOLUTION: In the method for fabricating the conductive structure on a flexible or rigid board by applying a coating agent containing a conductive material in a structured manner, and in a rotary printing machine equipped with at least a plurality of work units such as a printing apparatus and/or a vanish applying module, a conductive structure is fabricated in an image line section form in the first work unit in the first step, wherein the image line section is constituted of the coating agent containing the conductive material, and a post-treatment to enhance the in-layer conductivity forming the structure is performed in the second work unit in the second step. COPYRIGHT: (C)2008,JPO&INPIT
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