| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing electronic device capable of mass-productivity and also of eliminating the damage to electronic components, while reducing the impact of the flow pressure of a plasticization fusion sealing agent, or heat on the electronic components at the time of sealing. SOLUTION: While filling up a space 16a of an introduction passage 16 with a plasticization fusion sealing agent, a sealing cover 18 which encloses an electronic components 13 in the holder 12 of a case body 11 is formed by filling up a space 12a, in a holder 12 with a plasticization fusion sealing agent from the introduction passage 16 through a branch opening 17 and by solidifying the agent. COPYRIGHT: (C)2008,JPO&INPIT
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