| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing apparatus capable of excellently peeling from a substrate surface a resist film adhering to the substrate surface without damaging the substrate surface. SOLUTION: In a preprocessing unit 1, a substrate conveying mechanism 3 moves a substrate W substantially horizontally toward a cooling part while holding it substantially horizontally and dropping DIW from a liquid supply nozzle. Consequently, a liquid film is formed on the substrate surface entirely, and the liquid film is frozen at the cooling part. By the freezing of the liquid film, adhering force is weakened to a resist film to the substrate surface, or part of the resist film is separated from the substrate surface. Thereafter, the substrate W is conveyed from the preprocessing unit 1 to the cleaning unit 2, and SPM processing is executed at the cleaning unit 2. Consequently, the resist film is easily peeled from the substrate surface by applying physical shock to the substrate surface. COPYRIGHT: (C)2008,JPO&INPIT
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