| 摘要 |
A heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin and a thermofusible material, wherein the thermoplastic resin has a glass transition temperature of -70° C. to -30° C., and the thermofusible material comprises triphenylphosphine, and at least any one of tris(2,4-di-t-butylphenyl)phosphite and tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]methane, or a heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin, a thermofusible material and a non-thermofusible material, wherein the thermofusible material contains triphenylphosphine.
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