| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a rigid flexible printed circuit board of which a cost for a pre-process of a cover lay is reduced, a process for temporarily bonding the cover lay to a flexible copper-plated laminate is made easy, and the cost is reduced. <P>SOLUTION: The rigid flexible printed circuit board consists of a rigid region and a flexible region. The flexible region comprises a both-sided flexible copper-plated laminate 110, a cover lay 120 which is bonded to a copper foil layer 114 of the both-sided flexible copper-plated laminate, with a window 118 of a specified diameter being formed, and a plated layer 174 formed at the window. The plated layer comprises a CL via hole that is featured to further comprise an additional plated layer 172 formed on the cover lay around the window, by a diameter larger the specified diameter of the window. <P>COPYRIGHT: (C)2008,JPO&INPIT |
