| 发明名称 |
Thermally Conductive Material for Electronic and/or Electrical Components, and Use Thereof |
| 摘要 |
A thermally conductive and electrically insulating material, especially a paste, for mounting electrical and/or electronic components in housings and/or on cooling elements. The material is free of silicons and has a high filling ratio with moderate viscosity.
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| 申请公布号 |
US2008027155(A1) |
申请公布日期 |
2008.01.31 |
| 申请号 |
US20050592784 |
申请日期 |
2005.03.09 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT SIEMENS AG |
发明人 |
BAYER HEINER;DECKER MICHAEL;HEINL DIETER |
| 分类号 |
C08F2/46;C08F4/609;C08F10/08;C08G59/62;C08G59/68;C08K3/34;H01B3/02 |
主分类号 |
C08F2/46 |
| 代理机构 |
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