| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode package on which a light emitting diode, a driving chip, and an ESD protection element are mounted on the same base. <P>SOLUTION: The light emitting diode package 100 includes a base 60, a light emitting diode 20 mounted in a depressed portion of the base 60, and a driving chip 10 to drive the light emitting diode 20 and an ESD protection element 30 which are mounted inside the base 60. The light emitting diode, the driving chip, and the ESD element are connected to a predetermined lead frame 41 etc. with a wire 51 etc. respectively. <P>COPYRIGHT: (C)2008,JPO&INPIT |
