| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing equipment and a method of a substrate backing-up apparatus whereby backing-up pins set in the outside of the apparatus can be set in the inside of the apparatus as they are, and the substrate backing-up apparatus manufactured by the manufacturing method. <P>SOLUTION: The manufacturing equipment of the substrate backing-up apparatus is constituted of a jig main body for positioning in its predetermined location a substrate having no mounted electronic component, a mountable transparent plate 22 on the jig main body and above the substrate wherein pin attaching holes are formed, backing-up pins 23 to be inserted into the pin attaching holes of the transparent plate, and an attachable backing-up base 21 to an electronic-component mounting apparatus which is so coupled to the transparent plate that an end of each backing-up pin abuts on it. <P>COPYRIGHT: (C)2008,JPO&INPIT |
