发明名称 SAWING STRIP FOR SIMULTANEOUSLY SLICING MANY WAFERS FROM CYLINDRICAL WORK USING SAWING STRIP, AND METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To decrease more significantly local undulation occurring at the end area of a cutting section. <P>SOLUTION: The sawing strip 1 comprises a first plane 4 provided for combining with a work 2 and concavely incurvated perpendicularly to the longitudinal direction, a second plane 5 provided for combining with a mount plate and positioned back on to the first plane, and two lateral planes 6, 7 tieing the first plane with the second plane wherein the both end sides 8, 9 of the sawing strip has a predetermined distance (a), an imaginary straight line 10 defines a minimum distance (d) of the first plane to the second plane 5 along the first plane 4, a lateral planes 6, 7 has a distance (b) measured perpendicularly to the distance (d) at the height of the imaginary straight line 10, and the distance (b) is formed shorter than the distance (a). <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008018724(A) 申请公布日期 2008.01.31
申请号 JP20070182472 申请日期 2007.07.11
申请人 SILTRONIC AG 发明人 WIESNER PETER
分类号 B28D7/04;B24B27/06;B28D5/04 主分类号 B28D7/04
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