发明名称 SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment device that cleans and dries a substrate by supplying a plurality of chemical solutions and gases on the substrate. SOLUTION: A substrate treatment device 100 is characterized by including a substrate support mechanism 110 having a chuck on which a substrate is placed, a lower chamber 120 the upper part of which is opened and arranged so as to surround the periphery of the chuck, an upper chamber 130 that opens/closes the upper part of the lower chamber 120 so that a drying process of a substrate is advanced in a state of being isolated from outside, and an indirect injection nozzle 140 installed at an edge of the upper chamber 130 and which injects a dry fluid toward the center of the upper chamber so that the dry fluid is indirectly injected to the substrate. A substrate cleaning device with such a configuration is capable of obtaining effects such as increase in the drying efficiency of a substrate, shut-off of outside contamination, prevention of oxide film, etc. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008022010(A) 申请公布日期 2008.01.31
申请号 JP20070183069 申请日期 2007.07.12
申请人 SEMES CO LTD 发明人 KOO KYO-WOOG;CHO CHUNG-KUN;SUNG BO RAM CHAN
分类号 H01L21/304 主分类号 H01L21/304
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