发明名称 |
SUBSTRATE, AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate capable of forming a fine pattern by arbitrarily setting the thickness of a plated conductor pattern on the surface of an insulating base material, and to provide a manufacturing method for the substrate. SOLUTION: A via 3 formed while being penetrated from the surface of the insulating base material 2 to a rear is filled with a plating, and the plated conductor pattern is formed on at least the surface of the insulating base material 2. The fine pattern can be formed even when the plating is formed in the via 3 approximately flatly by making the plated conductor pattern lower than a height projected from the surface of the insulating base material 2 of the plating filled to the via 3. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008021770(A) |
申请公布日期 |
2008.01.31 |
申请号 |
JP20060191403 |
申请日期 |
2006.07.12 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SUGAWA TOSHIO;NAKAMURA SADASHI;IWAZAWA AYAKO |
分类号 |
H05K1/11;H05K3/40;H05K3/42 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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