| 摘要 |
<p>A surface-machining device for finishing the surface of a work such as a wafer and a cylinder inner surface to a mirror surface and a method of machining a work, which process the surface of a substrate with high machining efficiency and high precision. A method of machining a work for machining the surface of a wafer, a cylinder inner surface or the like as a work by using a cutting tool, wherein surface-machining is performed at a speed such that a cutting tool machining speed v satisfies v=c2 when the machining speed of the cutting tool with respect to the surface of a substrate is v and the transverse wave propagation speed of compression stress wave of a component material constituting the work is c<SUB>2</SUB>. It is preferable that the kinetic energy of the cutting tool before hitting the work is larger than a total of energy for shearing interatomic bonding elements of a material constituting the work, kinetic energy of the shaved off work moving together with the cutting tool and kinetic energy of the cutting tool moving at a speed at least a transverse wave propagation speed.</p> |
